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| M Features * * * * * * * * * TC1188/TC1189 General Description The TC1188 and TC1189 are fixed output, low dropout linear regulators that operate from a 2.7V to 6.0V input voltage source. The output is capable of delivering up to 120 mA while consuming only 50 A of quiescent current. The low dropout voltage, 120 mV, make the TC1188 and TC1189 good choices for battery powered applications. Integrated over-current and over-temperature protection features provide for a fault tolerant solution. The TC1189 includes an output voltage auto discharge feature. When shutdown, the TC1189 will automatically discharge the output voltage using an internal N-Channel MOSFET switch. Fixed output voltage options for the TC1188/TC1189 are: 1.80V, 2.80V, 2.84V and 3.15V. Both the TC1188 and TC1189 are available in SOT23-5 packages. MAX8863/64 Pin Compatible, Low Dropout, 120 mA Linear Regulators Input Voltage Range: 2.7 V to 6.0 V 120 mA Output Current Low Supply Current: 50 A, (typical) Low Dropout Voltage: 110 mV, (typical at 100 mA) Fast Turn-On from Shutdown: 140 sec (typical) Low Output Noise Over-Current and Over-Temperature Protection Low Power Shutdown Mode Auto Discharge of Output Capacitor (TC1189) Applications * * * * * * Battery Powered Systems Portable Computers Medical Instruments Cellular, Cordless Phones PDAs Pagers Typical Application Circuit VIN VOUT TC1188 TC1189 SHDN Output Voltage COUT 1 F Package Type 5-Pin SOT-23A GND 5 VOUT 4 TC1188 TC1189 1 2 3 + - Battery CIN 1 F GND GND SHDN GND VIN NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A) 2002 Microchip Technology Inc. DS21364B-page 1 TC1188/TC1189 1.0 ELECTRICAL CHARACTERISTICS *Notice: *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Short-Circuit Duration .............................Infinite Output Voltage .......................... (-0.3V) to (VIN + 0.3V) Maximum Voltage On Any Pin.... (-0.3V) to (VIN +0.3V) Continuous Power Dissipation (TA = +70C) SOT-23-5 (derate 7.1 mW/C above +70C) ..................................................................571 mW Operating Temperature Range............... -40C to 85C Storage Temperature .........................-65C to +160C Lead Temperature (Soldering, 10 Sec.) ........... +300C DC SPECIFICATIONS Electrical Characteristics: VIN = +3.6V, GND = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C. (Note 1) Parameters Input Voltage Output Voltage Symbol VIN VOUT Min VOUT+0.5V 2.7 3.05 2.75 2.70 1.745 Maximum Output Current Current Limit Input Current Dropout Voltage IOUT ILIM IIN 120 -- -- -- -- -- Line Regulation Load Regulation Output Voltage Noise Wake Up Time (from Shutdown Mode) Setting Time (from Shutdown Mode) tS -- 140 -- sec tWK VLNR VLDR -0.10 -- -- -- -- -- Typ -- -- 3.15 2.84 2.80 1.80 -- 280 50 1.1 55 110 0.001 -- 0.01 350 220 10 Max 6.0 6.0 3.25 2.93 2.88 1.85 -- -- 90 -- 120 240 0.10 -- 0.040 -- -- -- Units V V V V V mA mA A mV mV mV %/V %/V VRMS VRMS sec Note 3 IOUT = 0 IOUT = 1 mA IOUT = 50 mA IOUT = 100 mA (Note 4) VIN = VOUT + 0.5V to 6.0V IOUT = 1 mA 10 Hz to 1 MHz, COUT = 1 F 10 Hz to 1 MHz C OUT = 100 F VIN = 3.6V CIN = 1 F, COUT = 1 F IL = 30 mA, (See Figure 3-1) VIN = 3.6V CIN = 1 F, COUT = 1 F IL = 30 mA, (See Figure 3-1) Conditions VOUT 2.5V VOUT = 1.8V (Note 2) 0 mA IOUT 50 mA 0 mA IOUT 50 mA 0 mA IOUT 50 mA 0 mA IOUT 50 mA T S R Q %/mA IOUT = 0 mA to 50 mA Note 1: Limits are 100% production tested at TA = +25C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. 2: Validated by line regulation test. 3: Not tested. For design purposes, the current limit should be considered 150 mA minimum to 410 mA maximum. 4: The dropout voltage is defined as (VIN - VOUT) when VOUT is 100 mV below the value of VOUT for VIN = VOUT +2V. DS21364B-page 2 2002 Microchip Technology Inc. TC1188/TC1189 DC SPECIFICATIONS (CONTINUED) Electrical Characteristics: VIN = +3.6V, GND = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C. (Note 1) Parameters Shutdown: SHDN Input Threshold SHDN Input Bias Current Shutdown Supply Current Shutdown to Output Discharge Delay (TC1189) Thermal Protection Thermal Shutdown Temperature Thermal Shutdown Hysteresis TSHDN TSHDN -- -- 170 20 -- -- C C VIH VIL Ishdn Iqshdn 2.0 -- -- -- -- -- -- -- -- 0.1 50 0.002 0.02 1 -- 0.4 100 -- 1 -- -- V V nA nA A A msec VSHDN = VIN, TA = +25C, TA = TMAX VSHDN = VIN, TA = +25C, TA = TMAX VOUT = 0V, TA = +25C, TA = TMAX VOUT = 0V, TA = +25C, TA = TMAX COUT = 1 F, no load at 10% of VOUT Symbol Min Typ Max Units Conditions Note 1: Limits are 100% production tested at TA = +25C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. 2: Validated by line regulation test. 3: Not tested. For design purposes, the current limit should be considered 150 mA minimum to 410 mA maximum. 4: The dropout voltage is defined as (VIN - VOUT) when VOUT is 100 mV below the value of VOUT for VIN = VOUT +2V. 2002 Microchip Technology Inc. DS21364B-page 3 TC1188/TC1189 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.040 Line Reg. @ 3.50 V to 5.50V(%) LOAD REGULATION (%) 0.10 0.08 LINE REGULATION (%) 0.035 0.030 0.025 0.020 0.015 0.010 0.005 Load Reg. 0 to 50mA (%) Load Reg. 0 to 100mA (%) 0.06 0.04 0.02 0.00 -0.02 -0.04 -0.06 -0.08 -0.10 -40C 0C 25C 70C 85C 0.000 -40C 0C 25C 70C 85C TEMPERATURE (C) TEMPERATURE (C) FIGURE 2-1: Line Regulation vs. Temperature. (TC1188) 2.930 2.910 2.890 2.870 VOUT (V) VOUT - SET/1.0mA @ 3.5V (V) FIGURE 2-4: Load Regulation vs. Temperature. (TC1188) 0.120 0.100 0.080 (V) 0.060 0.040 0.020 0.000 -40C 50mA, Dropout V (V) 2.850 2.830 2.810 2.790 2.770 2.750 -40C 0C 25C 70C 85C 0C 25C 70C 85C TEMPERATURE (C) TEMPERATURE (C) FIGURE 2-2: Output Voltage vs. Temperature. (TC1188) 0.040 Load Reg. 0 to 50mA (%) 0.035 LOAD REGULATION (%) 0.030 0.025 0.020 0.015 0.010 0.005 0.000 -40C 0C 25C 70C 85C FIGURE 2-5: Dropout Voltage vs. Temperature. (TC1188) 10.0 RLOAD = 50 COUT = 1F Noise (V/HZ) 1.0 0.1 0.0 0.01 0.01 1 10 100 1000 TEMPERATURE (C) FREQUENCY (kHz) FIGURE 2-3: Load Regulation vs. Temperature. (TC1188) FIGURE 2-6: (TC1188) Output Noise vs. Frequency. DS21364B-page 4 2002 Microchip Technology Inc. TC1188/TC1189 -10 -20 -30 -40 -50 (dB) -60 -70 -80 -90 -100 10 100 1K 10K 100K 1M 10M 100sec/Div CH1 GND VOUT = 2.84V RLOAD = 50 100mV p-p CIN = COUT = 1F, RL = 470, XSHDN = 3.5V VIN = 4.5V VIN = 3.5V T CH1 COUT = 1F CH2 GND T VOUTAC 20V/DIV CH2 FREQUENCY (kHz) FIGURE 2-7: Power Supply Rejection Ratio vs. Frequency. (TC1188) T = 25 CIN = 1F CL =1F RL = VOUT = 0.5V/DIV FIGURE 2-10: OUTPUT, SHUTDOWN VOLTAGE (V) TC1189 Line Response. 3V SHDN 0V 2.8V SHDN SHDN = 0V CH1 GND VIN = 3.6V ILOAD = 30mA CIN = 1F CLOAD = 1F VOUT 0V TIME (100s/Div) CH2 GND 200sec/Div FIGURE 2-11: Wake-Up Response Time. FIGURE 2-8: Response. TC1189 Shutdown Transient T XSHDN = 3V Turn On Time = 150S VOUT = 2.7V CIN = 1F COUT =1F RL = 100 VIN = 3.5V CH2 XSHDN = 0V CH1 No Overshoot CH1 GND CH2 GND T VOUT = 0V 200sec/Div FIGURE 2-9: Response. TC1189 Shutdown Transient 2002 Microchip Technology Inc. DS21364B-page 5 TC1188/TC1189 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Symbol SHDN PIN FUNCTION TABLE Description Active Low Shutdown Input. When the SHDN input is low (< 0.2V), the quiscent current for the TC1188/TC1189 is reduced to 0.1 nA. When the input voltage to the SHDN pin is high (> 2.0V) the output of the TC1188/TC1189 is enabled. For the TC1189 only, the output capacitor is discharged by an internal switch when the SHDN is low. Ground. Connect to ground. Unregulated Input Voltage. The input voltage can range from 2.7V to 6.0V. Regulator Output. Sources up to 120 mA. Bypass with a 1 F, <1 typical ESR capacitor to GND. Connect to GND. released from shutdown. The settling time of the output voltage is dependent on load conditions and output capacitance on VOUT (RC response). VIH SHDN VIL 98% VOUT 2% tWK tS GND VIN VOUT GND 3.1 Detailed Description The TC1188/TC1189 devices are fixed output, low dropout linear regulators. Utilizing CMOS construction, the internal quiescent current consumed by the regulator is minimized when compared to older bipolar low dropout regulators. The LDO output voltage is sensed at the non-inverting pin of the internal error amplifier. The internal voltage reference is sensed at the inverting pin of the internal error amplifier. The error amplifier adjusts the gate source voltage of the internal P-channel pass device until the divided down output voltage matches the internal reference voltage. When it does, the LDO output voltage is in regulation. The SHDN, when pulled low, is used to turn off the PChannel MOSFET and lower the internal quiescent current to less than 1 A maximum. For normal operation, the SHDN pin is pulled to a high level. (> 2.0V). The TC1189 incorporates an internal N-Channel MOSFET, which is used to discharge the output capacitor when shutdown. The TC1188 does not have the internal N-Channel MOSFET, therefore, when the device is shutdown, the output voltage will decrease at a rate which is dependant on the load current. FIGURE 3-1: Wake-Up Response Time. 3.3 Internal P-Channel Pass Transistor The Internal P-Channel MOSFET is operated in the linear region to regulate the LDO output voltage. The RDSon of the P-Channel MOSFET is approximately 1.1 , making the LDO able to regulate with little input to output voltage differential, "Low Dropout". Another benefit of using CMOS construction is that the P-Channel MOSFET is a voltage controlled device, so it doesn't consume a fraction of the bias current required of bipolar PNP LDOs. 3.2 Turn-On Response The turn-on response is defined as two separate response categories: Wake-Up Time (tWK) and Settling Time (tS). The TC1188/TC1189 have fast wake-up times (10 sec typical) when released from shutdown. See Figure 3-1 for the wake-up time, designated as tWK. The wake-up time is defined as the time it takes for the output to rise to 2% of the VOUT value after being released from shutdown. The total turn on response is defined as the Settling Time (tS) (Figure 3-1). Settling Time (inclusive with tWK) is defined as the condition when the output is within 2% of its fully enabled value (140 sec typical) when DS21364B-page 6 2002 Microchip Technology Inc. TC1188/TC1189 VIN - SHDN Shutdown Logic + MOS Driver With ILIMIT PMOS Pass Transistor VOUT Error Amplifier N (TC1189 Only) Thermal Sensor GND GND Bandgap Reference FIGURE 3-2: Functional Block Diagram. 3.4 Shutdown 3.7 The SHDN input is used to turn off the LDO P-Channel pass MOSFET and internal bias. When shutdown, the typical quiescent current consumed by the LDO is 0.1 nA. A logic low (< 0.4V) at the SHDN input will cause the device to operate in the shutdown mode. A logic high (> 2.0V) at the SHDN input will cause the device to operate in the normal mode. Operating Region and Power Dissipation The internal power dissipation to the LDO is primarily determined by the input voltage, output voltage and output current. The following equation is used to approximate the worst case for power dissipation: EQUATION PD = VIN(MAX) - VOUT(MIN) x ILOAD(MAX) Where: PD = Worst case internal power dissipation. VIN(MAX) = Maximum input voltage. VOUT(MIN) = Minimum output voltage. ILOAD(MAX) = Maximum output current. The maximum power dissipation is a function of the maximum ambient temperature, TA(MAX), the maximum junction temperature, TJ(MAX), and the package thermal resistance from junction to air, JA. The 5-Pin SOT23A package has a JA of approximately 220C/Watt. 3.5 Current Limit The LDO output current is monitored internal to the TC1188/TC1189. The internal current sense will limit the LDO output current to a typical value of 280 mA. The current limit can range from approximately 50 mA to 410 mA from device to device. The internal current limit protects the device from a continuous output short circuit. 3.6 Thermal Overload Protection Integrated thermal protection circuitry shuts the TC1188/TC1189 off when the internal die temperature exceeds approximately 170C. The regulator output remains off until the internal die temperature drops to approximately 150C. EQUATION PD = (TJ(MAX) - TA(MAX))/JA Where all terms are previously defined. 2002 Microchip Technology Inc. DS21364B-page 7 TC1188/TC1189 EXAMPLE 3-1: The previously defined power dissipation equations can be used to ensure that the regulator thermal operation is within limits. Given: VIN(MAX) = 3.0V +10% VOUT(MAX) = 2.7V - 2.5% ILOAD(MAX) = 40 MA TJ(MAX) = 125C TA(MAX) = 55C 4.0 4.1 APPLICATIONS INFORMATION Input Capacitor Find: 1. 2. Actual power dissipation. Maximum allowable dissipation. A 1 F (or larger) capacitor is recommended to bypass the LDO input and lower input impedance for circuit stability when operating from batteries or high impedance sources. The input capacitor can be ceramic, tantalum or aluminum electrolytic. For applications that require low noise and input power supply rejection, low effective series resistance (ESR) ceramic capacitors are recommended over higher ESR electrolytic capacitors. Larger value input capacitors can be used to improve circuit performance. 4.2 Output Capacitor Actual power dissipation: PD = VIN(MAX) - VOUT(MIN) x ILOAD(MAX) PD = ((3.0 * 1.1) - (2.7 * 0.975)) * 40 mA PD = 26.7 mWatts A 1 F (minimum) capacitor is required from VOUT to ground to ensure circuit stability. The output capacitor should have an ESR greater than 0.1 ohms and less than 2 ohm. Tantalum or aluminum electrolytic capacitors are recommended. Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below 25C. Maximum allowable power dissipation: PD = (TJ(MAX) - TA(MAX))/JA PD(MAX) = (125 - 55) / 220 PD(MAX) = 318 mWatts. In this example, the TC1188/TC1189 dissipates a maximum of 26.7 mW below the allowable limit of 318 mW. In a similar manner, the power dissipation equation, as a function of VIN, VOUT and ILOAD, along with the power dissipation equation, as a function of maximum junction temperature, maximum ambient temperature and junction to air thermal resistance, can be used to calculate maximum current and/or maximum input voltage limits. DS21364B-page 8 2002 Microchip Technology Inc. TC1188/TC1189 5.0 5.1 PACKAGING INFORMATION Package Marking Information 5 4 1 2 3 Part Number TC1188-XECT TC1188-XECT TC1188-XECT TC1188-XECT TC1189-XECT TC1189-XECT TC1189-XECT TC1189-XECT (V) 1.80 2.80 2.84 3.15 1.80 2.80 2.84 3.15 Code G4 G3 G2 G1 H4 H3 H2 H1 Legend: 1-2 Part Number code + temperature range and voltage* 3 Year and two-month period code 4 Lot ID Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. 2002 Microchip Technology Inc. DS21364B-page 9 TC1188/TC1189 5-Lead Plastic Small Outline Transistor (OT) (SOT23) E E1 p B p1 D n 1 c A A2 L A1 Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D L c B MIN INCHES* NOM 5 .038 .075 .046 .043 .003 .110 .064 .116 .018 5 .006 .017 5 5 MAX MIN .035 .035 .000 .102 .059 .110 .014 0 .004 .014 0 0 .057 .051 .006 .118 .069 .122 .022 10 .008 .020 10 10 MILLIMETERS NOM 5 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0 5 0.09 0.15 0.35 0.43 0 5 0 5 MAX 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-178 Drawing No. C04-091 DS21364B-page 10 2002 Microchip Technology Inc. TC1188/TC1189 ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web (WWW) site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape or Microsoft Explorer. Files are also available for FTP download from our FTP site. Systems Information and Upgrade Hot Line The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive any currently available upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. 013001 Connecting to the Microchip Internet Web Site The Microchip web site is available by using your favorite Internet browser to attach to: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: * Latest Microchip Press Releases * Technical Support Section with Frequently Asked Questions * Design Tips * Device Errata * Job Postings * Microchip Consultant Program Member Listing * Links to other useful web sites related to Microchip Products * Conferences for products, Development Systems, technical information and more * Listing of seminars and events 2002 Microchip Technology Inc. DS21364B-page11 TC1188/TC1189 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this Data Sheet. To: RE: Technical Publications Manager Reader Response Total Pages Sent From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Device: TC1188/TC1189 Questions: 1. What are the best features of this document? Y N Literature Number: DS21364B FAX: (______) _________ - _________ 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this data sheet easy to follow? If not, why? 4. What additions to the data sheet do you think would enhance the structure and subject? 5. What deletions from the data sheet could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? 8. How would you improve our software, systems, and silicon products? DS21364B-page12 2002 Microchip Technology Inc. TC1188/TC1189 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Voltage Output /XX Package Examples: a) b) 100 mA, MAX8863/64 Pin Compatible LDO 100 mA, MAX8863/64 Pin Compatible LDO TC1188QECTTR: 1.80V, 100 mA, MAX8863/64 Pin Compatible LDO TC1188RECTTR: 2.80V, 100 mA, MAX8863/64 Pin Compatible LDO Device: TC1188: TC1189: Q R S T = = = = c) d) TC1188SECTTR: 2.84V, 100 mA, MAX8863/64 Pin Compatible LDO TC1188TECTTR: 3.15V, 100 mA, MAX8863/64 Pin Compatible LDO Voltage Output Options: 1.80V 2.80V 2.84V 3.15V = SOT-23A, 5-Pin (Tape and Reel) a) b) TC1189QECTTR: 1.80V, 100 mA, MAX8863/64 Pin Compatible LDO TC1189RECTTR: 2.80V, 100 mA, MAX8863/64 Pin Compatible LDO Package: ECTTR c) d) TC1189SECTTR: 2.84V, 100 mA, MAX8863/64 Pin Compatible LDO TC1189TECTTR: 3.15V, 100 mA, MAX8863/64 Pin Compatible LDO Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21364B-page13 TC1188/TC1189 NOTES: DS21364B-page 14 2002 Microchip Technology Inc. TC1188/TC1189 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, MXDEV, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. 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Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 France Microchip Technology SARL Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 New York 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 Germany Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 China - Hong Kong SAR Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 Austria Microchip Technology Austria GmbH Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 05/16/02 DS21364B-page 16 2002 Microchip Technology Inc. |
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